Credits: 5

Schedule: 13.09.2016 - 15.12.2016

Teaching Period (valid 01.08.2018-31.07.2020): 

I-II (Autumn 2018), I-II (Autumn 2019)

Learning Outcomes (valid 01.08.2018-31.07.2020): 

The purpose of the course is to provide a comprehensive understanding about the factors that affect the reliability of novel electronic products. The emphasis is placed on the accelerated reliability testing, life time prediction methods and physics of failure analysis. After the course the student should have a general understanding on the most common materials, structures, manufacturing methods and failure mechanisms of typical electronic components, packages, modules and devices.

Content (valid 01.08.2018-31.07.2020): 

Basics of the design for reliability and manufacturability. FMEA analysis and reliability metrology. Reliability prediction methods of electronic products. Different accelerated reliability testing methods. Failure mechanisms related failure analysis methods in different hierarchical levels of electronic systems.

Assessment Methods and Criteria (valid 01.08.2018-31.07.2020): 

Lectures, Midterm exams and Assignments

Workload (valid 01.08.2018-31.07.2020): 

Lectures and Midterm exams  48h

Independent work (Incl. Assignments) 82h

Study Material (valid 01.08.2018-31.07.2020): 


Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics

J. Liu, Reliability of Microtechnology

D. Crow, A. Feinberg, Design for reliability

D. H. Stamatis, Failure mode and effect analysis: FMEA from theory to execution

Substitutes for Courses (valid 01.08.2018-31.07.2020): 

S-113.3141 Design for Reliability

Course Homepage (valid 01.08.2018-31.07.2020):

Grading Scale (valid 01.08.2018-31.07.2020): 


Further Information (valid 01.08.2018-31.07.2020): 

language class 3: English