Laajuus: 5

Aikataulu: 12.09.2016 - 14.12.2016

Opetusperiodi (voimassa 01.08.2018-31.07.2020): 

I-II (Autumn 2018), I-II (Autumn 2019)

Osaamistavoitteet (voimassa 01.08.2018-31.07.2020): 

After the course the student is familiar with the 3D-integration processes and typical materials used in microsystem integration and is able to compare the advantages and disadvantages of different methods.The student will also gain knowledge about the properties of materials used and their compatibility issues in manufacturing of electronic systems. Advanced production processes and their effect on the quality and reliability must be understood. Special
emphasis is placed on experimental design as well as acquisition and critical analysis of information.

Sisältö (voimassa 01.08.2018-31.07.2020): 

The focus is in 3D-integration and interconnection technologies for MEMS/ASIC, sensor systems and power components. The knowledge gained in the lectures will be deepend through home work exercises. After the lecture series, advanced wafer-level interconnection technology will be developed in groups. Design of experiment (DoE) for bonding will be used and the full process from lithography to wafer bonding will be conducted. After mechanical and strcutural characterization of the bonded samples, improvement areas are identified and a new experiment will be setup to verify the planned improvement action.

Toteutus, työmuodot ja arvosteluperusteet (voimassa 01.08.2018-31.07.2020): 

Participation at the lectures, participation at the lab work and presentations
Grade based on active participation on teaching, homework, lab work and presentations

Työmäärä toteutustavoittain (voimassa 01.08.2018-31.07.2020): 

Lectures, laboratory work and presentations: 85 h

Compulsory attendance in laboratory work and presentations

Homework and Other independent work 45 h

Oppimateriaali (voimassa 01.08.2018-31.07.2020): 

Handout/Lecture slides.

Handbook of Silicon Based MEMS Materials and Technologies, 2 nd Edition, M. Tilli, S. Franssila, V. Airaksinen, M. Paulasto-Kröckel, T. Motooka and V. Lindroos

Fundamentals of Microsystem Packaging (Chapters 1, 2, 5, 16, 17, 22), R.Tummala.

Korvaavuudet (voimassa 01.08.2018-31.07.2020): 

ELEC-E8503 Materials & Microsystems Integration

Kurssin kotisivu (voimassa 01.08.2018-31.07.2020):

Arvosteluasteikko (voimassa 01.08.2018-31.07.2020): 


Lisätietoja (voimassa 01.08.2018-31.07.2020): 

language class 3: English

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