Credits: 5

Schedule: 10.09.2019 - 12.12.2019

Contact information for the course (applies in this implementation): For all course related matters please contact the responsible teacher:

Teaching Period (valid 01.08.2018-31.07.2020): 

I-II (Autumn 2018), I-II (Autumn 2019)

Learning Outcomes (valid 01.08.2018-31.07.2020): 

The purpose of the course is to provide a comprehensive understanding about the factors that affect the reliability of novel electronic products. The emphasis is placed on the accelerated reliability testing, life time prediction methods and physics of failure analysis. After the course the student should have a general understanding on the most common materials, structures, manufacturing methods and failure mechanisms of typical electronic components, packages, modules and devices.

Content (valid 01.08.2018-31.07.2020): 

Basics of the design for reliability and manufacturability. FMEA analysis and reliability metrology. Reliability prediction methods of electronic products. Different accelerated reliability testing methods. Failure mechanisms related failure analysis methods in different hierarchical levels of electronic systems.

Details on the course content (applies in this implementation): The course is divided into three parts: The first part covers generic reliability design related issues, the second part focuses on reliability testing and in the third part the most common failure mechanisms at different interconnection and packaging levels are presented.
Please, find more details from "Materials section" and first lecture slides.

Assessment Methods and Criteria (valid 01.08.2018-31.07.2020): 

Lectures, Midterm exams and Assignments

Elaboration of the evaluation criteria and methods, and acquainting students with the evaluation (applies in this implementation): The grading is based on three midterm exams and two assignments.
Please, find more details from "Materials section" and first lecture slides.

Workload (valid 01.08.2018-31.07.2020): 

Lectures and Midterm exams  48h

Independent work (Incl. Assignments) 82h

Details on calculating the workload (applies in this implementation): Please, find more details from "Materials section" and first lecture slides.

Study Material (valid 01.08.2018-31.07.2020): 


Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics

J. Liu, Reliability of Microtechnology

D. Crow, A. Feinberg, Design for reliability

D. H. Stamatis, Failure mode and effect analysis: FMEA from theory to execution

Details on the course materials (applies in this implementation): The books listed above (and in Oodi) cover the main parts of the course, but it is not necessary (or even recommended) to try to read all of those from beginning to end.
For those students who are able to attend the lectures the provided lecture slides should provide enough material for the midterm exams.
For self studying there will be few references mentioned in each lecture slides and/or some additional material is provided in the lecture folder.

Substitutes for Courses (valid 01.08.2018-31.07.2020): 

S-113.3141 Design for Reliability

Course Homepage (valid 01.08.2018-31.07.2020):

Grading Scale (valid 01.08.2018-31.07.2020): 


Further Information (valid 01.08.2018-31.07.2020): 

language class 3: English

Details on the schedule (applies in this implementation): Lectures on Tuesdays and Thursdays 8-10 o'clock in Micronova Large seminar room.
The most important dates:
- 1st midterm exam 3.10.2019
- 1st assignment DL 22.10.2019
- 2nd midterm exam 31.10.2019
- 2nd assignment DL 21.11.2019
- 3rd midterm exam 5.12.2019
- Extra midterm exams 10.12.2019

Please, find more details from "Materials section" and first lecture slides.


Registration and further information