Credits: 5

Schedule: 09.09.2019 - 11.12.2019

Teaching Period (valid 01.08.2018-31.07.2020): 

I-II (Autumn 2018), I-II (Autumn 2019)

Learning Outcomes (valid 01.08.2018-31.07.2020): 

After the course the student is familiar with the 3D-integration processes and typical materials used in microsystem integration and is able to compare the advantages and disadvantages of different methods.The student will also gain knowledge about the properties of materials used and their compatibility issues in manufacturing of electronic systems. Advanced production processes and their effect on the quality and reliability must be understood. Special
emphasis is placed on experimental design as well as acquisition and critical analysis of information.

Content (valid 01.08.2018-31.07.2020): 

The focus is in 3D-integration and interconnection technologies for MEMS/ASIC, sensor systems and power components. The knowledge gained in the lectures will be deepend through home work exercises. After the lecture series, advanced wafer-level interconnection technology will be developed in groups. Design of experiment (DoE) for bonding will be used and the full process from lithography to wafer bonding will be conducted. After mechanical and strcutural characterization of the bonded samples, improvement areas are identified and a new experiment will be setup to verify the planned improvement action.

Assessment Methods and Criteria (valid 01.08.2018-31.07.2020): 

Participation at the lectures, participation at the lab work and presentations
Grade based on active participation on teaching, homework, lab work and presentations

Workload (valid 01.08.2018-31.07.2020): 

Lectures, laboratory work and presentations: 85 h

Compulsory attendance in laboratory work and presentations

Homework and Other independent work 45 h

Study Material (valid 01.08.2018-31.07.2020): 

Handout/Lecture slides.

Handbook of Silicon Based MEMS Materials and Technologies, 2 nd Edition, M. Tilli, S. Franssila, V. Airaksinen, M. Paulasto-Kröckel, T. Motooka and V. Lindroos

Fundamentals of Microsystem Packaging (Chapters 1, 2, 5, 16, 17, 22), R.Tummala.

Substitutes for Courses (valid 01.08.2018-31.07.2020): 

ELEC-E8503 Materials & Microsystems Integration

Course Homepage (valid 01.08.2018-31.07.2020):

Grading Scale (valid 01.08.2018-31.07.2020): 


Further Information (valid 01.08.2018-31.07.2020): 

language class 3: English


Registration and further information