Course Overview

  • Course Overview

    Overview

    Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as lab work designed to give hands-on experience in fabricating an interconnect solution for smart system integration.

    • Instructors: Dr. Glenn Ross and Prof. Mervi Paulasto-Kröckel
    • Graduate course for 4/5 year students
    • Structure: Lectures, homework, lab work, group report and presentation
    • Lectures in Micronova, in small lecture room (2191)
      • Mondays 8:30 - 10
      • Wednesdays 8:30 -10

     

    Requirements & Grading

    • No exam
    • You are expected to participate in all lectures, lab work sessions and presentations
      •  If you cannot participate a lecture/lab work session, it can be replaced by a comprehensive report on the missed topic
    •  Grading from 0 (failed) to 5 (excellent)
      • 1/3 from homework (individual)
      • 2/3 from group work (group and individual)

     

    Lecture Schedule (Tentative)

    • 9.9 – Course introduction & microsystems integration
    • 11.9 – Electronics packaging and materials
    • 16.9 – Advanced packaging
    • 18.9 – Power electronics packaging and materials
    • 23.9 – Power components and modules integration
    • 25.9 – Cleanroom training and introduction to the lab work
    • 30.9 – MEMS packaging and integration
    • 2.10 – Wafer level bonding technologies and all-silicon integration
    • 7.10 – Photonics integration

     

    Homework

    Five homework topics will be given. Students will get familiar wit ha given text and answer questions or write a summary on the given topic. The student will have two weeks to complete the given homework.

    • Topics (tentative)
      • HW 1 (DL 23.9): Electronics packaging
      • HW 2 (DL 30.9): Advanced packaging strategies
      • HW 3 (DL 7.10): Power electronics
      • HW 4 (DL 14.10): MEMS and IC integration
      • HW 5 (DL 21.10): Printable electronics integration

     

    Course Material

    • Fundamentals of Microsystems Packaging
      • Ed. R. Tummala
        • Ch. 1,2 6-10 & 16
    • Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition
      • Edited by M.Tilli, T. Motooka, V.-M. Airaksinen, S. Franssila, M. Paulasto-Kröckel and V.Lindroos
        • Part V: Ch. 28, 32, 37 & 38

Materials►