Course Overview
Overview
Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as lab work designed to give hands-on experience in fabricating an interconnect solution for smart system integration.
- Instructors: Dr. Glenn Ross and Prof. Mervi Paulasto-Kröckel
- Graduate course for 4/5 year students
- Structure: Lectures, homework, lab work, group report and presentation
- Lectures in Micronova, in small lecture room (2191)
- Mondays 8:30 - 10
- Wednesdays 8:30 -10
Requirements & Grading
- No exam
- You are expected to participate in all lectures, lab work sessions and presentations
- If you cannot participate a lecture/lab work session, it can be replaced by a comprehensive report on the missed topic
- Grading from 0 (failed) to 5 (excellent)
- 1/3 from homework (individual)
- 2/3 from group work (group and individual)
Lecture Schedule
- 9.9 – Course introduction & microsystems integration
- 11.9 – Electronics packaging and materials
- 16.9 – Advanced packaging
- 18.9 – Power
electronics packaging and materials
- 23.9 –
Power components and modules integration
- 25.9 –
Cleanroom training and introduction to the lab work
- 30.9 – MEMS
packaging and integration
- 2.10 – Wafer
level bonding technologies and all-silicon integration
- 7.10 –
Photonics integration
Homework
Five homework topics will be given. Students will get familiar wit ha given text and answer questions or write a summary on the given topic. The student will have two weeks to complete the given homework.
- Topics
- HW 1 (DL 23.9): Electronics packaging
- HW 2 (DL
30.9): Advanced packaging strategies
- HW 3 (DL
7.10): Power electronics
- HW 4 (DL
14.10): MEMS and IC integration
- HW 5 (DL
21.10): Printable electronics integration
Course Material
- Fundamentals of Microsystems Packaging
- Ed. R.
Tummala
- Ch. 1,2 6-10 & 16
- Handbook
of Silicon Based MEMS Materials and Technologies, 2nd Edition
- Edited by M.Tilli, T. Motooka, V.-M. Airaksinen, S. Franssila, M. Paulasto-Kröckel and V.Lindroos
- Part V: Ch. 28, 32, 37 & 38