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ELEC-E8713 - Materials and Microsystems Integration, 09.09.2019-11.12.2019

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Syllabus

Course Overview

  • Course Overview

    Course Overview

    Overview

    Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as lab work designed to give hands-on experience in fabricating an interconnect solution for smart system integration.

    • Instructors: Dr. Glenn Ross and Prof. Mervi Paulasto-Kröckel
    • Graduate course for 4/5 year students
    • Structure: Lectures, homework, lab work, group report and presentation
    • Lectures in Micronova, in small lecture room (2191)
      • Mondays 8:30 - 10
      • Wednesdays 8:30 -10

     

    Requirements & Grading

    • No exam
    • You are expected to participate in all lectures, lab work sessions and presentations
      •  If you cannot participate a lecture/lab work session, it can be replaced by a comprehensive report on the missed topic
    •  Grading from 0 (failed) to 5 (excellent)
      • 1/3 from homework (individual)
      • 2/3 from group work (group and individual)

     

    Lecture Schedule

    • 9.9 – Course introduction & microsystems integration
    • 11.9 – Electronics packaging and materials
    • 16.9 – Advanced packaging
    • 18.9 – Power electronics packaging and materials
    • 23.9 – Power components and modules integration
    • 25.9 – Cleanroom training and introduction to the lab work
    • 30.9 – MEMS packaging and integration
    • 2.10 – Wafer level bonding technologies and all-silicon integration
    • 7.10 – Photonics integration

     

    Homework

    Five homework topics will be given. Students will get familiar wit ha given text and answer questions or write a summary on the given topic. The student will have two weeks to complete the given homework.

    • Topics
      • HW 1 (DL 23.9): Electronics packaging
      • HW 2 (DL 30.9): Advanced packaging strategies
      • HW 3 (DL 7.10): Power electronics
      • HW 4 (DL 14.10): MEMS and IC integration
      • HW 5 (DL 21.10): Printable electronics integration

     

    Course Material

    • Fundamentals of Microsystems Packaging
      • Ed. R. Tummala
        • Ch. 1,2 6-10 & 16
    • Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition
      • Edited by M.Tilli, T. Motooka, V.-M. Airaksinen, S. Franssila, M. Paulasto-Kröckel and V.Lindroos
        • Part V: Ch. 28, 32, 37 & 38

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