ELEC-E8713 - Materials and Microsystems Integration, 09.09.2019-11.12.2019

Assignments

• Assignments
  

  Assignments

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    HW 1 (DL 23.9): Electronics packaging Assignment
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    HW 2 (DL 30.9): Advanced intergration Assignment
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    HW 3 (DL 7.10): Power electronics Assignment
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    HW 4 (DL 14.10): MEMS and IC integration Assignment
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    HW 5 (DL 21.10): Printable electronics Assignment
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    Labwork Report - Group A Assignment
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    Labwork Presentation - Group A Assignment
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    Labwork Report - Group B Assignment
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    Labwork Presentation - Group B Assignment