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ELEC-E8713 - Materials and Microsystems Integration D, 07.09.2020-09.12.2020

This course space end date is set to 09.12.2020 Search Courses: ELEC-E8713

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Syllabus
 

7.9 - 16.9 Fundamentals of microelectronic systems integration

  • 7.9 - 16.9 Fundamentals of microelectronic systems integration

    7.9 - 16.9 Fundamentals of microelectronic systems integration

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      7.9 - Lecture 1: Definitions, trends, and challenges Lesson
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      9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages Lesson
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      14.9 - Lecture 3: Single chip processes Lesson
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      7.9 - Homework 1 Lesson
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◄7.9 - Course Introduction

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21.9 - 28.9 Materials compatibility - Binary and ternary phase diagrams►
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  • ELEC-E8713 - Materials and Microsystems Integration D, 07.09.2020-09.12.2020
  • Sections
  • Course Overview
  • 7.9 - Course Introduction
  • 7.9 - 16.9 Fundamentals of microelectronic systems integration
  • 21.9 - 28.9 Materials compatibility - Binary and ternary phase diagrams
  • 30.9 - 7.10 Materials compatibility - Principles of reaction & diffusion in electronic materials
  • 12.10 Mechanical properties of materials
  • 14.10 - 21.10 Advanced packaging & wafer-level processes
  • 26.10 - 28.10 MEMS packaging and integration
  • 2.11 - 9.11 Power semiconductor devices
  • 4.11 Photonics integration
  • Homework
  • Virtual Lab Work
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