Topic outline

  • 7.9 - 16.9 Fundamentals of microelectronic systems integration

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      7.9 - Lecture 1: Definitions, trends, and challenges Lesson
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      7.9 - Lecture 1: Definitions, trends, and challenges File
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      9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages Lesson
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      9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages File
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      14.9 - Lecture 3: Single chip processes Lesson
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      14.9 - Lecture 3: Single chip processes File
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      7.9 - Homework 1 Lesson
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      7.9 - Homework 1 File
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7.9 - Course Introduction
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21.9 - 28.9 Materials compatibility - Binary and ternary phase diagrams