ELEC-E8713 - Materials and Microsystems Integration D, 07.09.2020-09.12.2020

Topic outline

• 7.9 - 16.9 Fundamentals of microelectronic systems integration
  • Select activity 7.9 - Lecture 1: Definitions, trends, and challenges

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    7.9 - Lecture 1: Definitions, trends, and challenges Lesson
  • Select activity 7.9 - Lecture 1: Definitions, trends, and challenges

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    7.9 - Lecture 1: Definitions, trends, and challenges File PDF
  • Select activity 9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages Lesson
  • Select activity 9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages File PDF
  • Select activity 14.9 - Lecture 3: Single chip processes

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    14.9 - Lecture 3: Single chip processes Lesson
  • Select activity 14.9 - Lecture 3: Single chip processes

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    14.9 - Lecture 3: Single chip processes File PDF
  • Select activity 7.9 - Homework 1

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    7.9 - Homework 1 Lesson
  • Select activity 7.9 - Homework 1

    Not available unless: Your User account contains (use: aalto.fi) is aalto.fi

    

    7.9 - Homework 1 File PDF