Topic outline

  • Homework

    • Assignment icon
      HW1 - Microelectronic system integration Assignment
      Not available unless: Your User account contains (use: aalto.fi) is aalto.fi
    • Assignment icon
      HW2 - Advanced wafer-level packaging Assignment
      Not available unless: Your User account contains (use: aalto.fi) is aalto.fi
    • Assignment icon
      HW3 - MEMS packaging and integration Assignment
      Not available unless: Your User account contains (use: aalto.fi) is aalto.fi
    • Assignment icon
      HW4 - Power semiconductor devices Assignment
      Not available unless: Your User account contains (use: aalto.fi) is aalto.fi
    • Assignment icon
      HW5 - Photonic integration Assignment
      Not available unless: Your User account contains (use: aalto.fi) is aalto.fi
◄ Previous section
29.11 - Photonics integration
Next section ►
Teardown lab work