Please note! Course description is confirmed for two academic years, which means that in general, e.g. Learning outcomes, assessment methods and key content stays unchanged. However, via course syllabus, it is possible to specify or change the course execution in each realization of the course, such as how the contact sessions are organized, assessment methods weighted or materials used.


The learning outcomes of this course is firstly to understand the fundamentals of microelectronic systems integration, including IC, MEMS/ASIC, sensor systems and power systems. A focus will be placed on the integration technologies (from 2D to 3D technologies), processes and typical materials used in microsystems, allowing the student to critically evaluate and compare integration technologies. Additionally, an understanding of the interdependence of material properties, materials compatibility, production processes and their impact on quality/reliability will be obtained. To achieve this, thermodynamics and reaction kinetics and theories of microstructure will be addressed. Develop effective scientific literature review and writing methods during the course.

Credits: 5

Schedule: 05.09.2022 - 07.12.2022

Teacher in charge (valid for whole curriculum period):

Teacher in charge (applies in this implementation): Mervi Paulasto-Kröckel, Vesa Vuorinen, Glenn Ross

Contact information for the course (applies in this implementation):

CEFR level (valid for whole curriculum period):

Language of instruction and studies (applies in this implementation):

Teaching language: English. Languages of study attainment: English


  • valid for whole curriculum period:

    The contents of the course will include and introduction to microelectronic 3D-integration, specifically technologies utilised in IC, MEMS/ASIC, sensor systems and power components. Following this, the basics of materials compatibly, chemical reaction between materials, interfacial phenomena and their effects on material properties will be presented with examples and exercises applied to microelectronic integration. Interpretation of phase diagrams, diffusion mechanisms and microstructures of common microelectronic systems will be presented. The students will also participate in teardown laboratory that will critically evaluate commercial microelectronic components.

Assessment Methods and Criteria
  • valid for whole curriculum period:

    Homework (individual)

    Peer-review (individual)

    Lab participation (individual)

    Pre-teardown review (group)

    Final report & presentation (group)

  • valid for whole curriculum period:

    Lectures (compulsory attendance) : 27h

    Exercises/Independent work : 54h

    Laboratory work : 34h



Substitutes for Courses


Further Information
  • valid for whole curriculum period:

    Teaching Language : English

    Teaching Period : 2022-2023 Autumn I - II
    2023-2024 Autumn I - II

    Enrollment :

    Registration for Courses on Sisu (