LEARNING OUTCOMES
The purpose of the course is to provide a comprehensive understanding about the factors that affect the reliability of novel electronic products. The emphasis is placed on the fundamentals of electronics integration and packaging, accelerated reliability testing, life-time prediction methods and physics of failure analysis and mechanisms. After the course, the student should have a general understanding on the most common materials, structures, manufacturing methods and failure mechanisms of typical electronic components, packages, modules and devices.
Credits: 5
Schedule: 03.09.2024 - 28.11.2024
Teacher in charge (valid for whole curriculum period):
Teacher in charge (applies in this implementation): Vesa Vuorinen, Mervi Paulasto-Kröckel
Contact information for the course (applies in this implementation):
For all course related matters please contact Vesa via e-mail
Vesa.Vuorinen(ät)aalto.fi
CEFR level (valid for whole curriculum period):
Language of instruction and studies (applies in this implementation):
Teaching language: English. Languages of study attainment: English
CONTENT, ASSESSMENT AND WORKLOAD
Content
valid for whole curriculum period:
Basics of the design for reliability and manufacturability. FMEA analysis and reliability metrology. Reliability prediction methods of electronic products. Different accelerated reliability testing methods. Electronics packaging and integration. Failure mechanisms related failure analysis methods in different hierarchical levels of electronic systems.
applies in this implementation
Please check course syllabus and 1st lecture material for more information. Those are found under "Materials" section
Assessment Methods and Criteria
valid for whole curriculum period:
Midterm exams and Assignments
applies in this implementation
Please check course syllabus and 1st lecture material for more information. Those are found under "Materials" section
Workload
valid for whole curriculum period:
Lectures and Midterm exams
Independent work (Incl. Assignments)applies in this implementation
Please check course syllabus and 1st lecture material for more information. Those are found under "Materials" section
DETAILS
Study Material
valid for whole curriculum period:
Handouts with supplementary backing material
For self-studying or distant learning:
Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics
J. Liu, Reliability of Microtechnology
D. Crow, A. Feinberg, Design for reliability
D. H. Stamatis, Failure mode and effect analysis: FMEA from theory to execution
applies in this implementation
Please check course syllabus and 1st lecture material for more information. Those are found under "Materials" section
Substitutes for Courses
valid for whole curriculum period:
Prerequisites
valid for whole curriculum period:
FURTHER INFORMATION
Further Information
valid for whole curriculum period:
Teaching Language: English
Teaching Period: 2024-2025 Autumn I - II
2025-2026 Autumn I - II
Details on the schedule
applies in this implementation
The detailed schedule is presented at the front page ("General") of the course