ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 5.9.2022-7.12.2022

Topic outline

• Homework
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    HW1 - Microelectronic system integration Turnitin Assignment 2

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    HW2 - Advanced wafer-level packaging Turnitin Assignment 2

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    HW3 - MEMS packaging and integration Turnitin Assignment 2

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    HW4 - Power semiconductor devices Turnitin Assignment 2

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    HW5 - Photonic integration Turnitin Assignment 2

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