LEARNING OUTCOMES
The course's learning outcomes are understanding the fundamentals of microelectronics systems integration for System-on-Chip (SoC) hardware design for heterogenous integration. This includes focusing on IC, MEMS/ASIC, and sensor systems.
- Awareness of Industry Trends: Staying updated with the latest advancements in semiconductor and packaging manufacturing technologies, such as emerging technologies, new materials, interconnect technologies, 3D integration, and their impact on chip design.
- Process-Aware Design Optimization: Ability to optimize chip designs considering process-related limitations such as manufacturing restrictions, wafer-level process, process variations, etc., to achieve the desired performance.
- Process Integration Knowledge: Understanding how different process modules (such as lithography, etching, wafer-level process, etc.) come together in semiconductor fabrication and their impact on the final chip design.
- Design for Manufacturing (DFM) Principles: Understanding how design decisions affect manufacturability. Knowledge of DFM techniques to optimize designs for yield, reliability, and performance while considering manufacturing constraints. These include electrical, material, and thermomechanical performance considerations.
- Reverse engineer current state-of-the-art microelectronic component: Basic understanding of the role of reverse engineering and developing the ability to evaluate current state-of-the-art microelectronic integration approaches critically.
Credits: 5
Schedule: 02.09.2024 - 02.12.2024
Teacher in charge (valid for whole curriculum period):
Teacher in charge (applies in this implementation): Mervi Paulasto-Kröckel, Vesa Vuorinen, Glenn Ross
Contact information for the course (applies in this implementation):
CEFR level (valid for whole curriculum period):
Language of instruction and studies (applies in this implementation):
Teaching language: English. Languages of study attainment: English
CONTENT, ASSESSMENT AND WORKLOAD
Content
valid for whole curriculum period:
The contents of the course will include and introduction to microelectronic 3D-integration, specifically technologies utilised in IC, MEMS/ASIC, sensor systems and power components. Following this, the basics of materials compatibly, chemical reaction between materials, interfacial phenomena and their effects on material properties will be presented with examples and exercises applied to microelectronic integration. Interpretation of phase diagrams, diffusion mechanisms and microstructures of common microelectronic systems will be presented. The students will also participate in teardown laboratory that will critically evaluate commercial microelectronic components.
Assessment Methods and Criteria
valid for whole curriculum period:
Assignments
Laboratory work
Workload
valid for whole curriculum period:
Lectures
Assessments
Laboratory work
DETAILS
Study Material
valid for whole curriculum period:
Handout/Lecture slides.
Handbook of Silicon Based MEMS Materials and Technologies, 3rd Edition, M.Tilli, M. Paulasto-Kröckel, M. Petzold, H. Theuss, T. Motooka, and V.Lindroos
Fundamentals of Microsystem Packaging (Chapters 1, 2, 6-10, 12 & 16), R.Tummala.
Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics
Paul, A., Laurila, T., Vuorinen, V., Divinski, S.V., Thermodynamics, Diffusion and the Kirkendall Effect in Solids, Chapters 1-5
Substitutes for Courses
valid for whole curriculum period:
Prerequisites
valid for whole curriculum period:
FURTHER INFORMATION
Further Information
valid for whole curriculum period:
Teaching Language: English
Teaching Period: 2024-2025 Autumn I - II
2025-2026 Autumn I - II