Please note! Course description is confirmed for two academic years, which means that in general, e.g. Learning outcomes, assessment methods and key content stays unchanged. However, via course syllabus, it is possible to specify or change the course execution in each realization of the course, such as how the contact sessions are organized, assessment methods weighted or materials used.

LEARNING OUTCOMES

The purpose of the course is to provide a comprehensive understanding about the factors that affect the reliability of novel electronic products. The emphasis is placed on the fundamentals of electronics integration and packaging, accelerated reliability testing, life-time prediction methods and physics of failure analysis and mechanisms. After the course, the student should have a general understanding on the most common materials, structures, manufacturing methods and failure mechanisms of typical electronic components, packages, modules and devices.

Credits: 5

Schedule: 14.09.2021 - 14.12.2021

Teacher in charge (valid for whole curriculum period):

Teacher in charge (applies in this implementation): Vesa Vuorinen, Mervi Paulasto-Kröckel

Contact information for the course (applies in this implementation):

For all course related matters please contact Vesa Vuorinen

Vesa.Vuorinen(ät)aalto.fi

CEFR level (valid for whole curriculum period):

Language of instruction and studies (applies in this implementation):

Teaching language: English. Languages of study attainment: English

CONTENT, ASSESSMENT AND WORKLOAD

Content
  • valid for whole curriculum period:

    Basics of the design for reliability and manufacturability. FMEA analysis and reliability metrology. Reliability prediction methods of electronic products. Different accelerated reliability testing methods. Electronics packaging and integration. Failure mechanisms related failure analysis methods in different hierarchical levels of electronic systems.

  • applies in this implementation

    Detailed description of the cource content, workload, requirements and assignment methods can be found in "Materials" section under "Syllabus" and "Kick-off lecture" folders.

Assessment Methods and Criteria
  • valid for whole curriculum period:

    Midterm exams and Assignments

  • applies in this implementation

    Detailed description of the cource content, workload, requirements and assignment methods can be found in "Materials" section under "Syllabus" and "Kick-off lecture" folders.

Workload
  • valid for whole curriculum period:

    Lectures and Midterm exams  44h

    Independent work (Incl. Assignments) 88h

  • applies in this implementation

    Detailed description of the cource content, workload, requirements and assignment methods can be found in "Materials" section under "Syllabus" and "Kick-off lecture" folders.

DETAILS

Study Material
  • valid for whole curriculum period:

    Handouts with supplementary backing material

    For self-studying or distant learning:

    Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics

    J. Liu, Reliability of Microtechnology

    D. Crow, A. Feinberg, Design for reliability

    D. H. Stamatis, Failure mode and effect analysis: FMEA from theory to execution

Substitutes for Courses
Prerequisites

FURTHER INFORMATION

Further Information
  • valid for whole curriculum period:

    Teaching Period:

    2020-2021 Autumn I-II

    2021-2022 Autumn I-II

    Course Homepage: https://mycourses.aalto.fi/course/search.php?search=ELEC-E8712

    Registration for Courses: In the academic year 2021-2022, registration for courses will take place on Sisu (sisu.aalto.fi) instead of WebOodi.