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ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021

This course space end date is set to 15.12.2021 Search Courses: ELEC-E8713

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Syllabus

Course Overview

  • Course Overview

    Course Overview

    Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as a teardown lab designed to give you experience in scientific writing, designing of experiments and interpretation of results from state-of-the-art components using unique integration methods.

    • Course responsible person: Dr. Glenn Ross (glenn.ross@aalto.fi)
    • Lab work responsible person: (M.Sc) Ms. Fahimeh Emadi  (fahimeh.emadi@aalto.fi)
    • Graduate course for 4/5 year students
    • Structure: Lectures, homework and teardown lab work 
      • Lectures will be online (Zoom). A link to the Zoom session can be found under "Sections" and the respective lecture.


    Requirements & Grading

      • No exam
      • You are expected to participate in all lectures, lab work sessions and presentations
        •  If you cannot participate a lecture/lab work session, please contact the course responsible person.
      •  Grading from 0 (failed) to 5 (excellent)
        • 1/3 from homework (individual)
        • 2/3 from teardown  lab work, report and presentation/discussion session (individual and group)


    Course schedule

    Course schedule

    Course Material

    • Fundamentals of Microsystems Packaging
      • Ed. R. Tummala
        • Ch. 1,2 6-10 & 16
    • Handbook of Silicon Based MEMS Materials and Technologies, 3rd Edition
      • Edited by M.Tilli, M. Paulasto-Kröckel, M. Petzold, H. Theuss, T. Motooka, and V.Lindroos
        • Part IV: Ch. 23-26, 32, 33

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13.09 - Course introduction & microsystems integration►
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  • ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021
  • Sections
  • Course Overview
  • 13.09 - Course introduction & microsystems integration
  • 20.09 - Microsystems integration, package purpose, hierarchy, and single chip packages
  • 27.09 - Microsystems integration, 1st level processes
  • 04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials
  • 11.10 - Advanced packaging
  • 18.10 - Wafer-level processes
  • 01.11 - MEMS packaging and integration
  • 15.11 - Power semiconductor devices
  • 29.11 - Photonics integration
  • Homework
  • Teardown lab work
  • Resources
  • Attendance
  • Home
  • Calendar
  • Learner Metrics

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