Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as a teardown lab designed to give you experience in scientific writing, designing of experiments and interpretation of results from state-of-the-art components using unique integration methods.
- Course responsible person: Dr. Glenn Ross (firstname.lastname@example.org)
- Lab work responsible person: (M.Sc) Ms. Fahimeh Emadi (email@example.com)
- Graduate course for 4/5 year students
- Structure: Lectures, homework and teardown lab work
- Lectures will be online (Zoom). A link to the Zoom session can be found under "Sections" and the respective lecture.
Requirements & Grading
- No exam
- You are expected to participate in all lectures, lab work sessions and presentations
- If you cannot participate a lecture/lab work session, please contact the course responsible person.
- Grading from 0 (failed) to 5 (excellent)
- 1/3 from homework (individual)
- 2/3 from teardown lab work, report and presentation/discussion session (individual and group)
- Fundamentals of Microsystems Packaging
- Ed. R. Tummala
- Ch. 1,2 6-10 & 16
- Handbook of Silicon Based MEMS Materials and Technologies, 3rd Edition
- Edited by M.Tilli, M. Paulasto-Kröckel, M. Petzold, H. Theuss, T. Motooka, and V.Lindroos
- Part IV: Ch. 23-26, 32, 33