ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021

Topic outline

• Homework
  • Select activity HW1 - Microelectronic system integration

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    HW1 - Microelectronic system integration Assignment
  • Select activity HW2 - Advanced wafer-level packaging

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    HW2 - Advanced wafer-level packaging Assignment
  • Select activity HW3 - MEMS packaging and integration

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    HW3 - MEMS packaging and integration Assignment
  • Select activity HW4 - Power semiconductor devices

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    HW4 - Power semiconductor devices Assignment
  • Select activity HW5 - Photonic integration

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    HW5 - Photonic integration Assignment