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ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021

This course space end date is set to 15.12.2021 Search Courses: ELEC-E8713

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Teardown lab work

  • Teardown lab work

    Teardown lab work

    Recorded live pre-teardown lab work instructions and group formation:

    Teardown lab work - instructions and group formation



    Recorded live teardown peer review instructions & lab preparation:

    Teardown lab work - peer review instructions and lab preparation


    Recorded final report and presentation instructions:

    Teardown lab work - final report and presentation instructions


    Recorded peer evaluation instructions:

    Teardown lab work - Peer evaluation instructions







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      Final lab work report (group) Assignment
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      Peer evaluation form File
      Excel 2007 spreadsheet
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      Excel 2007 spreadsheet
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      Excel 2007 spreadsheet
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      Excel 2007 spreadsheet
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      Peer evaluation form File
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      Teardown peer evaluation form Assignment
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      Teardown lab work pre-review instructions and group formation File
      PDF document
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      Teardown peer review instructions & lab preparation File
      PDF document
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      Final report and presentation instructions File
      PDF document
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      Teardown report template File
      Word 2007 document
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      Optical components Folder
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  • ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021
  • Sections
  • Course Overview
  • 13.09 - Course introduction & microsystems integration
  • 20.09 - Microsystems integration, package purpose, hierarchy, and single chip packages
  • 27.09 - Microsystems integration, 1st level processes
  • 04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials
  • 11.10 - Advanced packaging
  • 18.10 - Wafer-level processes
  • 01.11 - MEMS packaging and integration
  • 15.11 - Power semiconductor devices
  • 29.11 - Photonics integration
  • Homework
  • Teardown lab work
  • Resources
  • Attendance
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