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ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021

This course space end date is set to 15.12.2021 Search Courses: ELEC-E8713

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04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials

  • 04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials

    04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials

    Recorded live lecture 4:

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◄27.09 - Microsystems integration, 1st level processes

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11.10 - Advanced packaging►
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  • ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 13.9.2021-15.12.2021
  • Sections
  • Course Overview
  • 13.09 - Course introduction & microsystems integration
  • 20.09 - Microsystems integration, package purpose, hierarchy, and single chip packages
  • 27.09 - Microsystems integration, 1st level processes
  • 04.10 - Thermodynamics and mechanics of materials for microelectronic relevant materials
  • 11.10 - Advanced packaging
  • 18.10 - Wafer-level processes
  • 01.11 - MEMS packaging and integration
  • 15.11 - Power semiconductor devices
  • 29.11 - Photonics integration
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    • – Instructions for report writing (CHEM)
    • School of Electrical Engineering (ELEC)
    • School of Engineering (ENG)
    • School of Science (SCI)
    • Language Centre
    • Open University
    • Library
    • Aalto university pedagogical training program
    • UNI (exams)
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  • ALLWELL?
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