ELEC-E8713 - Materials and Microsystems Integration D, Lecture, 4.9.2023-4.12.2023
This course space end date is set to 04.12.2023 Search Courses: ELEC-E8713
Topic outline
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Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to the advanced 3-dimensional electronics integration. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as a teardown lab designed to give you experience in scientific writing, designing experiments and interpreting results from state-of-the-art components using unique integration methods.
- Course responsible person: Dr. Glenn Ross (glenn.ross@aalto.fi)
- Lab work responsible person: (M.Sc) Mr. Obert Golim (obert.golim@aalto.fi)
- Graduate course for 4/5 year students
- Structure: Lectures, assignments and teardown lab work
Requirements & Grading
- No exam
- You are expected to participate in all lectures, lab work sessions and presentations
- If you cannot participate in a lecture/lab work session, please contact the course responsible person.
- Grading from 0 (failed) to 5 (excellent)
- 50% Assignments 1 & 2
- 50% Teardown labwork
- Turnitin plagiarism checker will be used during the course
Course Schedule
Course Material
- Fundamentals of Microsystems Packaging
- Ed. R. Tummala
- Ch. 1,2,4 6-10 & 16
- Handbook of Silicon Based MEMS Materials and Technologies, 3rd Edition
- Edited by M.Tilli, M. Paulasto-Kröckel, M. Petzold, H. Theuss, T. Motooka, and V.Lindroos
- Part IV: Ch. 23-26, 32, 33