Please note! Course description is confirmed for two academic years (1.8.2018-31.7.2020), which means that in general, e.g. Learning outcomes, assessment methods and key content stays unchanged. However, via course syllabus, it is possible to specify or change the course execution in each realization of the course, such as how the contact sessions are organized, assessment methods weighted or materials used.
The learning outcomes of this course is firstly to understand the fundamentals of microelectronic systems integration, including IC, MEMS/ASIC, sensor systems and power systems. A focus will be placed on the integration technologies (from 2 to 3D technologies), processes and typical materials used in microsystems, allowing the student to critically evaluate and compare integration technologies. Additionally, an understanding of the interdependence of material properties, materials’ compatibility, production processes and their impact on quality/reliability will be obtained. To achieve this, thermodynamics and reaction kinetics and theories of microstructure will be addressed. Scientific writing methods applied throughout the course.
Schedule: 07.09.2020 - 09.12.2020
Teacher in charge (valid 01.08.2020-31.07.2022): Mervi Paulasto-Kröckel, Glenn Ross, Vesa Vuorinen
Teacher in charge (applies in this implementation): Mervi Paulasto-Kröckel, Glenn Ross, Vesa Vuorinen
Contact information for the course (applies in this implementation):
CEFR level (applies in this implementation):
Language of instruction and studies (valid 01.08.2020-31.07.2022):
Teaching language: English
Languages of study attainment: English
CONTENT, ASSESSMENT AND WORKLOAD
The contents of the course will include and introduction to microelectronic 3D-integration, specifically technologies utilised in IC, MEMS/ASIC, sensor systems and power components. Following this, the basics of materials compatibly, chemical reaction between materials, interfacial phenomena and their effects on material properties will be presented with examples and exercises applied to microelectronic integration. Interpretation of phase diagrams, diffusion mechanisms and microstructures of common microelectronic systems will be presented. The students will also participate in laboratory sessions that will evaluate 3D-integrated samples.
Assessment Methods and Criteria
Participation at the lectures, participation at the lab work and presentations
Grade based on active participation on teaching, homework, lab work and presentations
Lectures (compulsory attendance) : 32h
Exercises/Independent work : 59h
Laboratory work : 39h
Handbook of Silicon Based MEMS Materials and Technologies, 2 nd Edition, M. Tilli, S. Franssila, V. Airaksinen, M. Paulasto-Kröckel, T. Motooka and V. Lindroos
Fundamentals of Microsystem Packaging (Chapters 1, 2, 5, 16, 17, 22), R.Tummala.
Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics
Paul, A., Laurila, T., Vuorinen, V., Divinski, S.V., Thermodynamics, Diffusion and the Kirkendall Effect in Solids, Chapters 1-5
Substitutes for Courses
ELEC-E8503 Materials & Microsystems Integration