Please note! Course description is confirmed for two academic years (1.8.2018-31.7.2020), which means that in general, e.g. Learning outcomes, assessment methods and key content stays unchanged. However, via course syllabus, it is possible to specify or change the course execution in each realization of the course, such as how the contact sessions are organized, assessment methods weighted or materials used.


The learning outcomes of this course is firstly to understand the fundamentals of microelectronic systems integration, including IC, MEMS/ASIC, sensor systems and power systems. A focus will be placed on the integration technologies (from 2 to 3D technologies), processes and typical materials used in microsystems, allowing the student to critically evaluate and compare integration technologies. Additionally, an understanding of the interdependence of material properties, materials’ compatibility, production processes and their impact on quality/reliability will be obtained. To achieve this, thermodynamics and reaction kinetics and theories of microstructure will be addressed. Scientific writing methods applied throughout the course.

Credits: 5

Schedule: 07.09.2020 - 09.12.2020

Teacher in charge (valid 01.08.2020-31.07.2022): Mervi Paulasto-Kröckel, Glenn Ross, Vesa Vuorinen

Teacher in charge (applies in this implementation): Mervi Paulasto-Kröckel, Glenn Ross, Vesa Vuorinen

Contact information for the course (applies in this implementation):

CEFR level (applies in this implementation):

Language of instruction and studies (valid 01.08.2020-31.07.2022):

Teaching language: English

Languages of study attainment: English


  • Valid 01.08.2020-31.07.2022:

    The contents of the course will include and introduction to microelectronic 3D-integration, specifically technologies utilised in IC, MEMS/ASIC, sensor systems and power components. Following this, the basics of materials compatibly, chemical reaction between materials, interfacial phenomena and their effects on material properties will be presented with examples and exercises applied to microelectronic integration. Interpretation of phase diagrams, diffusion mechanisms and microstructures of common microelectronic systems will be presented. The students will also participate in laboratory sessions that will evaluate 3D-integrated samples.

Assessment Methods and Criteria
  • Valid 01.08.2020-31.07.2022:

    Participation at the lectures, participation at the lab work and presentations
    Grade based on active participation on teaching, homework, lab work and presentations

  • Valid 01.08.2020-31.07.2022:

    Lectures (compulsory attendance) : 32h

    Exercises/Independent work : 59h

    Laboratory work : 39h



Study Material
  • Valid 01.08.2020-31.07.2022:

    Handout/Lecture slides.

    Handbook of Silicon Based MEMS Materials and Technologies, 2 nd Edition, M. Tilli, S. Franssila, V. Airaksinen, M. Paulasto-Kröckel, T. Motooka and V. Lindroos

    Fundamentals of Microsystem Packaging (Chapters 1, 2, 5, 16, 17, 22), R.Tummala.

    Laurila, T., Vuorinen, V., Paulasto-Kröckel, M., Turunen, M., Mattila, T.T., Kivilahti, J., Interfacial Compatibility in Microelectronics

    Paul, A., Laurila, T., Vuorinen, V., Divinski, S.V., Thermodynamics, Diffusion and the Kirkendall Effect in Solids, Chapters 1-5

Substitutes for Courses
  • Valid 01.08.2020-31.07.2022:

    ELEC-E8503 Materials & Microsystems Integration



Registration and further information