Topic outline

  • Course Overview

    • Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as a virtual lab designed to give you experience in scientific writing, designing of experiments and interpretation of results from a interconnect solution for smart system integration.

      • Course responsible person: Dr. Glenn Ross (glenn.ross@aalto.fi)
      • Graduate course for 4/5 year students
      • Structure: Lectures, homework and virtual lab work
      • On demand lectures (available from the scheduled lecture time in MyCourses)
      • Interactive zoom sessions at the end of each lecture module

    Requirements & Grading

      • No exam
      •  Grading from 0 (failed) to 5 (excellent)
        • 2/3 from homework
        • 1/3 from virtual lab work, report and one-on-one presentation/discussion session

     

    Lecture Schedule (when on demand videos become available)

      • 7.9 – Course introduction & microsystems integration
      • 9.9 – Microsystems integration, package purpose, hierarchy, and single chip packages
      • 14.9 - Microsystems integration, 1st level processes
        • 16.9 – Interactive Zoom session (8:30 – 10am)
      • 21. 9 – Binary and ternary phase diagram interpretation
      • 23. 9 - Binary and ternary phase diagram interpretation (cont.)
        • 28.9 – Interactive Zoom session (8:30 – 10am)
      • 30.9 – Reaction kinetics & diffusion
      • 5.10 – Reaction kinetics & diffusion (cont.)
        • 7.10 – Interactive Zoom session (8:30 – 10am)
      • 12.10 – Mechanical properties of materials
      • 14.10 – Advanced packaging
      • 19.10 – Wafer-level processes
        • 21.10 – Interactive Zoom session (8:30 – 10am)
      • 26.10 – MEMS packaging and integration
        • 28.10 – Interactive Zoom session (8:30 – 10am)
      • 2.11 – Power semiconductor devices
      • 4.11 – Photonics integration
        • 9.11 – Power semiconductor devices - Interactive Zoom session (8:30 – 10am)
      • 11.11 – Introduction to the virtual lab work
        • 16.11 – Interactive Zoom session (8:30 – 10am)

       

      Homework

      • HW 1 (DL 21.9): Microelectronic systems integration
      • HW 2 (DL 19.10): Materials compatibility, interactions, thermodynamics, and reaction kinetics (in two parts)
      • HW 3 (DL 28.10): Advanced wafer-level packaging
      • HW 4 (DL 9.11): MEMS packaging and integration
      • HW 5 (DL 16.11): Power semiconductor devices

       

      Virtual Lab Work - Deadlines

        • Report - 14th of December at midnight
        • Presentation - date and time agreed for the final presentation

      Course Material

      • Fundamentals of Microsystems Packaging
        • Ed. R. Tummala
          • Ch. 1,2 6-10 & 16
      • Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition
        • Edited by M.Tilli, T. Motooka, V.-M. Airaksinen, S. Franssila, M. Paulasto-Kröckel and V.Lindroos
          • Part V: Ch. 28, 32, 37 & 38

  • 7.9 - Course Introduction


  • 7.9 - 16.9 Fundamentals of microelectronic systems integration

  • 21.9 - 28.9 Materials compatibility - Binary and ternary phase diagrams


  • 30.9 - 7.10 Materials compatibility - Principles of reaction & diffusion in electronic materials

  • 12.10 Mechanical properties of materials

  • 14.10 - 21.10 Advanced packaging & wafer-level processes

  • 26.10 - 28.10 MEMS packaging and integration

  • 2.11 - 9.11 Power semiconductor devices

  • 4.11 Photonics integration

  • Homework


  • Virtual Lab Work

    Virtual lab work instructions:


  • Results

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