Course Overview
Materials and Microsystems Integration (MMI) introduces students to the world of smart systems integration. This course will discuss current electronic packaging methods and extend this to advanced 3-dimensional integration of electronics. Materials, materials compatibility and technologies used to achieve electronic integration will be discussed, as well as a virtual lab designed to give you experience in scientific writing, designing of experiments and interpretation of results from a interconnect solution for smart system integration.
- Course responsible person: Dr. Glenn Ross (glenn.ross@aalto.fi)
- Graduate course for 4/5 year students
- Structure: Lectures, homework and virtual lab work
- On demand lectures (available from the scheduled lecture time in MyCourses)
- Interactive zoom sessions at the end of each lecture module
Requirements & Grading
- No exam
- Grading from 0 (failed) to 5 (excellent)
- 2/3 from homework
- 1/3 from virtual lab work, report and one-on-one presentation/discussion session
Lecture Schedule (when on demand videos become available)
- 7.9 – Course introduction &
microsystems integration
- 9.9 – Microsystems integration, package purpose, hierarchy, and single chip packages
- 14.9 - Microsystems integration, 1st level processes
- 16.9 – Interactive Zoom session (8:30 – 10am)
- 21. 9 – Binary and ternary phase
diagram interpretation
- 23. 9 - Binary and ternary phase
diagram interpretation (cont.)
- 28.9 – Interactive Zoom session (8:30 – 10am)
- 30.9 – Reaction kinetics &
diffusion
- 5.10 – Reaction kinetics &
diffusion (cont.)
- 7.10 – Interactive Zoom session (8:30 – 10am)
- 12.10 – Mechanical properties of materials
- 14.10 – Advanced packaging
- 19.10 – Wafer-level processes
- 21.10 – Interactive Zoom session (8:30 – 10am)
- 26.10 – MEMS packaging and integration
- 28.10 – Interactive Zoom session (8:30 – 10am)
- 2.11 – Power semiconductor devices
- 4.11 – Photonics integration
- 9.11 – Power semiconductor devices - Interactive Zoom session (8:30 – 10am)
- 11.11 – Introduction to the virtual lab work
- 16.11 – Interactive Zoom session (8:30 – 10am)
- HW 1 (DL 21.9): Microelectronic systems integration
- HW 2 (DL 19.10): Materials compatibility, interactions, thermodynamics, and reaction kinetics (in two parts)
- HW 3 (DL 28.10): Advanced wafer-level packaging
- HW 4 (DL 9.11): MEMS packaging and integration
- HW 5 (DL 16.11): Power semiconductor devices
- Report - 14th of December at midnight
- Presentation - date and time agreed for the final presentation
- Fundamentals of Microsystems Packaging
- Ed. R. Tummala
- Ch. 1,2 6-10 & 16
- Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition
- Edited by M.Tilli, T. Motooka, V.-M. Airaksinen, S. Franssila, M. Paulasto-Kröckel and V.Lindroos
- Part V: Ch. 28, 32, 37 & 38
Homework
Virtual Lab Work - Deadlines
Course Material