ELEC-E8713 - Materials and Microsystems Integration D, 07.09.2020-09.12.2020

Topic outline

• Homework
  
  

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    HW 1 (DL 21.9): Electronics packaging Turnitin Assignment 2

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    HW 2 (DL 19.10): Materials compatibility Assignment

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    HW 3 (DL 28.10): Advanced packaging & wafer-level processes Turnitin Assignment 2

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    HW 4 (DL 9.11): MEMS packaging and integration Turnitin Assignment 2

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    HW 5 (DL 16.11): Power semiconductor devices Turnitin Assignment 2

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