ELEC-E8713 - Materials and Microsystems Integration D, 07.09.2020-09.12.2020
This course space end date is set to 09.12.2020 Search Courses: ELEC-E8713
Topic outline
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7.9 - Lecture 1: Definitions, trends, and challenges Lesson
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7.9 - Lecture 1: Definitions, trends, and challenges FilePDF document
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9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages Lesson
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9.9 - Lecture 2: Packaging purpose, hierarchy, and single chip packages FilePDF document
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14.9 - Lecture 3: Single chip processes Lesson
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14.9 - Lecture 3: Single chip processes FilePDF document
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7.9 - Homework 1 Lesson
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7.9 - Homework 1 FilePDF document
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